NEW LEAD-FREE, SN-ZN-IN SOLDER ALLOYS

被引：137

作者：

MCCORMACK, M ^{[1
]}

JIN, S ^{[1
]}

CHEN, HS ^{[1
]}

MACHUSAK, DA ^{[1
]}

机构：

[1] AT&T BELL LABS,PRINCETON,NJ 08540

来源：

JOURNAL OF ELECTRONIC MATERIALS | 1994年 / 23卷 / 07期

关键词：

CREEP; LEAD-FREE SOLDER; PB-FREE SOLDER; SOLDER; WETTABILITY;

D O I：

10.1007/BF02653357

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In view of the need for a lead-free, drop-in replacement for the widely used 40Pb-60Sn near-eutectic solder (m.p. approximately 183-degrees-C), new Sn-Zn-In based alloys with substantially the same melting point have been developed. It is shown that the alloying additions of In to the Sn-Zn binary system result in a suppression of the melting point to 175-188-degrees-C, and at the same time significantly improve the wetting characteristics. While a relatively active flux may be required for good solderability in air atmosphere, the recent manufacturing trend of using inert atmospheres is likely to allow acceptable manufacturability using less active fluxes in the future.

引用

页码：687 / 690

页数：4

共 9 条

[1]

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[2]

Massalski T.B, 1991, BINARY ALLOY PHASE D, V2nd, P3417

[3] PROGRESS IN THE DESIGN OF NEW LEAD-FREE SOLDER ALLOYS [J].

MCCORMACK, M ;

JIN, SH .

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[4]

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[5]

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[6]

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[7]

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[8]

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[9]

1991, EPA56FR2209698

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