SYNTHESIS, STRUCTURE, AND THERMAL-PROPERTIES OF EPOXY-IMIDE RESIN CURED BY PHOSPHORYLATED DIAMINE

被引：83

作者：

CHIN, WK ^{[1
]}

SHAU, MD ^{[1
]}

TSAI, WC ^{[1
]}

机构：

[1] CHIA NAN JR COLL PHARM,DEPT APPL CHEM,TAINAN,TAIWAN

来源：

JOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRY | 1995年 / 33卷 / 03期

关键词：

EPOXY-IMIDE RESIN; PHOSPHORYLATED DIAMINE; THERMAL RESISTANCE; CHAR YIELD;

D O I：

10.1002/pola.1995.080330304

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

New phosphorylated epoxy-imide polymer was obtained using diimide-diepoxide (DIDE) cured with bis(3-aminophenyl)methylphosphine oxide (BAMP). In addition, composition of the synthesized diimide-diepoxide (DIDE) with common curing agents, e.g., 4,4'-diaminodiphenylether (DDE) and 4,4'-diaminodiphenylsulfone (DDS), were used for making a comparison of its curing reactivity, heat and flame retardation with that of bis(3-aminophenyl)methylphosphine oxide. The reactivity of those curing agents toward epoxy-imide, as measured by differential scanning calorimetry (DSC), was of the order DDE > BAMP > DDS. Through the evaluation of thermal gravimetric analysis (TGA), the new phosphorylated epoxy-imide polymer demonstrated excellent thermal properties as well as a high char yield. (C) 1995 John Wiley and Sons, Inc.

引用

页码：373 / 379

页数：7

共 12 条

[1]

Lee H., 1967, HDB EPOXY RESINS, P4

[2] CURING OF N,N'-DIGLYCIDYLIMIDES WITH POLYFUNCTIONAL COMPOUNDS [J].