DEVELOPMENT OF CONDUCTIVE ADHESIVE JOINING FOR SURFACE-MOUNTING ELECTRONICS MANUFACTURING

被引：32

作者：

LIU, J

LJUNGKRONA, L

LAI, ZH

机构：

[1] Swedish Institute of Production Engineering Research (IVF), Mölndal

[2] Swedish Institute of Production Engineering Research, Volvo Aero Corporation AB, Space Propulsion Division, Trollhättan

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 1995年 / 18卷 / 02期

关键词：

D O I：

10.1109/96.386267

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper presents the results of a study of process development for conductive adhesives as solder replacement. The main objective of the work was to investigate the potentials for using conventional surface-mounting equipment for component assembly with conductive adhesives. Two processes have been studied: one which uses both anisotropically and isotropically conductive adhesives and one which uses isotropically conductive adhesives only. The results from the work show that currently available surface-mounting machinery can be used for the conductive adhesive joining process. However, further work is needed to optimize the processing conditions. Transmission electron microscopy analysis of the adhesive joints after temperature cycling and humidity testing shows that oxide layer formation on metal surfaces can be one of the mechanisms which causes decrease in the electrical performance of the joint.

引用

页码：313 / 319

页数：7