SOLID-STATE BONDING BETWEEN VANADIUM ALLOYS AND ALUMINA

被引：4

作者：

ABE, K

HIGUCHI, T

FUJINO, Y

机构：

[1] Department of Nuclear Engineering, Tohoku University, Aoba-ku, Sendai, 980, Aramaki-aza-Aoba

来源：

JOURNAL OF NUCLEAR MATERIALS | 1991年 / 179卷

关键词：

D O I：

10.1016/0022-3115(91)90201-H

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The solid-state bonding between two types of vanadium alloys and alumina was examined. One is V-5Ti-5Cr-1Si-1Y-1Al alloy and the other is V-25Ti-15Cr-1Si-1Y-0.5Al alloy. Couples of the alloys and alumina disks with 8 mm diameter were heat-treated for bonding in a vacuum of 1 x 10(-3) Pa at temperatures of 1673 and 1773 K under compression of 5.5 MPa. Bonding between the alloys and alumina was confirmed by means of transmission electron microscopy. Macroscopically, however, peripheral cracks and a series of pores were observed in alumina side, which were attributed to the residual stress. Influences of alloying on the bonding mode are discussed.

引用

页码：766 / 770

页数：5

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