EFFECTS OF POLYMER METAL INTERACTION IN THIN-FILM MULTICHIP MODULE APPLICATIONS

An investigation was conducted to examine the effects of different polyimide / metal combinations on structures similar to those used in thin-film multichip module applications. Three different metal structures and three commercially available spin-on polyimide materials which possess different molecular structures were examined. Transmission electron microscopy (TEM) was used to study the polyimide / metal interfaces. Measurements of the electrical signal propagation through the different polyimide / metal structures were compared. It was found that the extent of interaction of polyimide with copper is dependent upon the type of polyimide used. The use of an electroless nickel layer over copper structures as well as the use of aluminum conductor lines with different polyimides were also examined. © 1990 IEEE