THE BANDED STRUCTURE OF NI-P ELECTRODEPOSITS

被引：35

作者：

NEE, CC

WEIL, R

机构：

来源：

SURFACE TECHNOLOGY | 1985年 / 25卷 / 01期

关键词：

D O I：

10.1016/0376-4583(85)90043-3

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：7 / 15

页数：9

共 11 条

[1]

BALDWIN C, 1968, T I METAL FIN, V46, P73, DOI DOI 10.1080/00202967.1968.11870052

[2] STRUCTURE OF CHEMICALLY DEPOSITED NICKEL [J].

GOLDENSTEIN, AW ;

ROSTOKER, W ;

SCHOSSBERGER, F ;

GUTZEIT, G .

[3]

GOULD AJ, 1981, SURF TECHNOL, V12, P102

[4]

Gutzeit G., 1959, PLATING, V46, P1158

[5] SOME THEORETICAL ASPECTS OF PULSE ELECTROLYSIS [J].

IBL, N .

SURFACE TECHNOLOGY, 1980, 10 (02) :81-104

[6]

LASHMORE DS, 1982, PLAT SURF FINISH, V69, P72

[7] PULSE ELECTROPLATING OF SILVER-TIN ALLOYS AND FORMATION OF AG3SN [J].

LEIDHEISER, H ;

GHUMAN, ARP .

[8]

Ogburn F., 1973, Plating, V60, P1043

[9]

PRATER TA, 1949, PLATING E ORANGE, V36, P271

[10]

RUFF AW, 1982, AM SOC TEST MATER SP, V769, P134