CORRELATION OF SILVER MIGRATION WITH TEMPERATURE HUMIDITY BIAS (THB) FAILURES IN MULTILAYER CERAMIC CAPACITORS

被引：54

作者：

LING, HC

JACKSON, AM

机构：

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1989年 / 12卷 / 01期

关键词：

D O I：

10.1109/33.19027

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：130 / 137

页数：8

共 16 条

[1] CHANG SA, 1980, 1980 P ISTFA INT S T, P153
[2] CHITTICK RC, 1983, IEEE T COMPON HYBR, V5, P297
[3] HAUSER V, COMMUNICATION
[4] DIFFUSION AND ELECTROMIGRATION OF SILVER AND NICKEL IN LEAD-TIN ALLOYS
HU, CK
HUNTINGTON, HB
[J]. PHYSICAL REVIEW B, 1982, 26 (06): : 2782 - 2789
[5] KRUMBEIN SJ, 1978, 9TH P INT C EL CONT, P145
[6] LING HC, IN PRESS J AM CERAM
[7] LING HC, 1988, 38TH P EL COMP C, P87
[8] MCBRAYER JD, 1980, J ELECTROCHEM SOC, V133, P1242
[9] ACCELERATED LIFE TESTING AND RELIABILITY OF HIGH K-MULTILAYER CERAMIC CAPACITORS
MINFORD, WJ
[J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1982, 5 (03): : 297 - 300
[10] MUNIKOTI R, 1987, 37TH P EL COMP C BOS, P129