The stress voiding behavior of Al(Si) (Cu) alloys has been investigated. The grain structure of the metal lines has been analyzed using the electron backscatter diffraction technique in a scanning electron microscope. A [111] fiber texture of aluminum has been observed perpendicular to the wafer surface. A correlation has been found between a high density of voids and the amount of misalignment of the [111] grain directions with respect to the wafer normal.