CORRELATION BETWEEN STRESS VOIDING OF AL(SI)(CU) METALLIZATIONS AND CRYSTAL ORIENTATION OF ALUMINUM GRAINS

被引:22
作者
KORDIC, S
WOLTERS, RAM
TROOST, KZ
机构
[1] Philips Research Laboratories, 5600 JA Eindhoven
关键词
D O I
10.1063/1.354243
中图分类号
O59 [应用物理学];
学科分类号
摘要
The stress voiding behavior of Al(Si) (Cu) alloys has been investigated. The grain structure of the metal lines has been analyzed using the electron backscatter diffraction technique in a scanning electron microscope. A [111] fiber texture of aluminum has been observed perpendicular to the wafer surface. A correlation has been found between a high density of voids and the amount of misalignment of the [111] grain directions with respect to the wafer normal.
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页码:5391 / 5394
页数:4
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