VACANCIES IN CSCL-TYPE INTERMETALLIC COMPOUNDS - STRUCTURAL VERSUS THERMAL

被引：10

作者：

KIM, SM

机构：

来源：

PHYSICAL REVIEW B | 1986年 / 33卷 / 02期

关键词：

D O I：

10.1103/PhysRevB.33.1509

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：1509 / 1511

页数：3

共 33 条

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[4]

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[8]

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[9]

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