THERMALLY INDUCED STRUCTURAL AND COMPOSITIONAL MODIFICATION OF THE CU SI(111)-7X7 INTERFACE

被引:19
作者
CHAMBERS, SA [1 ]
WEAVER, JH [1 ]
机构
[1] BETHEL COLL,DEPT CHEM,ST PAUL,MN 55112
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1985年 / 3卷 / 05期
关键词
D O I
10.1116/1.572947
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
引用
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页码:1929 / 1934
页数:6
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