FRACTURE STRENGTH MEASUREMENT OF FILAMENT ASSISTED CVD POLYCRYSTALLINE DIAMOND FILMS

被引：36

作者：

CARDINALE, GF ^{[1
]}

ROBINSON, CJ ^{[1
]}

机构：

[1] RAYTHEON CO,DIV RES,LEXINGTON,MA 02173

来源：

JOURNAL OF MATERIALS RESEARCH | 1992年 / 7卷 / 06期

关键词：

D O I：

10.1557/JMR.1992.1432

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The fracture strength of polycrystalline diamond films deposited by filament assisted chemical vapor deposition in the thickness range of 3.5 to 160-mu-m is investigated. Using a burst pressure technique, the fracture strengths of circular diamond film specimens are calculated. An average fracture strength of 730 MPa for nine samples was computed. This value is in good agreement with published strengths of microwave plasma deposited diamond films, comparable to other high strength materials, and within an order of magnitude of the fracture strength of bulk natural diamond. The average fracture strength of the fine-grained substrate interface appears consistently higher than that of the coarse-grained diamond growth surface.

引用

页码：1432 / 1437

页数：6

共 23 条

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[Anonymous], 1979, PROPERTIES DIAMOND

[2]

BERMAN R, 1965, PHYSICAL PROPERTIES

[3]

BERMAN R, 1965, PHYSICAL PROPERTIES, P180

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