ANALYSIS OF PACKAGED MICROWAVE INTEGRATED-CIRCUITS BY FDTD

被引：18

作者：

MEZZANOTTE, P ^{[1
]}

MONGIARDO, M ^{[1
]}

ROSELLI, L ^{[1
]}

SORRENTINO, R ^{[1
]}

HEINRICH, W ^{[1
]}

机构：

[1] FERDINAND BRAUN INST,D-124889 BERLIN,GERMANY

来源：

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 1994年 / 42卷 / 09期

关键词：

D O I：

10.1109/22.310590

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 [电气工程]; 0809 [电子科学与技术];

摘要：

The behavior of packaged single and coupled MMIC via-hole grounds has been investigated by using a graded mesh FDTD code running on the massive parallel computer DEC 12000 with 4 K processors. Theoretical simulations have been compared with experimental measurements showing excellent agreement. Moreover, since the package introduces resonances, we have also investigated several different possibilities to choke off these resonances. It is shown that the common practice of inserting a damping layer just below the lid is often not effective. In particular, the importance of placing damping layers also on the side walls is demonstrated.

引用

页码：1796 / 1801

页数：6

共 36 条

[1]

BIERMAN H, 1992, MICROWAVE J SEP, P100

[2]

BUCHANAN W, 8TH P IEE INT C ANT, P639

[3]

BURKE JJ, 1991 INT IEEE MTT S, P1221

[4]

CERRI G, 1993, 23RD P EUR MICR C