CORRELATED ELECTRONIC-STRUCTURE OF THE HIGH-TC SUPERCONDUCTOR RE1BA2CU3O7-X PHASE AND POSSIBLE INTERLAYER PAIRING

被引：4

作者：

ESCHRIG, H ^{[1
]}

SEIFERT, G ^{[1
]}

机构：

[1] TECH UNIV DRESDEN, SEKT PHYS, DDR-8027 DRESDEN, GERMANY

来源：

PHYSICA SCRIPTA | 1989年 / T25卷

关键词：

D O I：

10.1088/0031-8949/1989/T25/014

中图分类号：

O4 [物理学];

学科分类号：

0702 ;

摘要：

引用

页码：88 / 90

页数：3

共 28 条

[1] THE THEORY OF HIGH-TC SUPERCONDUCTORS - COMPARISONS WITH EXPERIMENT
ANDERSON, PW
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ZOU, Z
WHEATLEY, J
HSU, T
SHASTRY, BS
DOUCOT, B
LIANG, S
[J]. PHYSICA C, 1988, 153 : 527 - 530
[2] BATLOGG B, 1988, P C HTSCM2S INTERLAK, P560
[3] THE BAND ELECTRONIC-STRUCTURE OF THE HIGH-TEMPERATURE SUPERCONDUCTING CERAMICS LA2-XMXCUO4 AND YBA2CU3O7-Y
BULLETT, DW
DAWSON, WG
[J]. JOURNAL OF PHYSICS C-SOLID STATE PHYSICS, 1987, 20 (31): : L853 - L860
[4] OXYGEN VACANCY ORDERING IN BA2YCU3O7-X AROUND X=0.5
CHAILLOUT, C
ALARIOFRANCO, MA
CAPPONI, JJ
CHENAVAS, J
STROBEL, P
MAREZIO, M
[J]. SOLID STATE COMMUNICATIONS, 1988, 65 (04) : 283 - 286
[5] ELECTRONIC-STRUCTURE CALCULATIONS FOR OXOCUPRATE CLUSTERS OF THE HIGH-TC SUPERCONDUCTING PHASES
ESCHRIG, H
SEIFERT, G
[J]. SOLID STATE COMMUNICATIONS, 1987, 64 (04) : 521 - 525
[6] ELECTRONIC-STRUCTURE ANALYSIS OF LNBA2CU3O7-X - IMPLICATIONS ON NORMAL AND SUPERCONDUCTIVITY
ESCHRIG, H
SEIFERT, G
[J]. PHYSICA C, 1988, 153 : 1243 - 1244
[7] ELECTRONIC-STRUCTURE ANALYSIS OF LNBA2CU3O7-X - IMPLICATIONS ON NORMAL CONDUCTIVITY AND SUPERCONDUCTIVITY
ESCHRIG, H
SEIFERT, G
[J]. SOLID STATE COMMUNICATIONS, 1988, 65 (12) : 1525 - 1527
[8] CURRENT THEORIES OF THE HIGH-TC SUPERCONDUCTING MATERIALS
FULDE, P
[J]. PHYSICA C, 1988, 153 (02): : 1769 - 1774
[9] ELECTRONIC-STRUCTURE OF OXYGEN-DEFICIENT HIGH-TC SUPERCONDUCTORS - YBA2CU3OX (6-LESS-THAN-OR-EQUAL-TO-X-LESS-THAN-OR-EQUAL-TO-8)
HERMAN, F
KASOWSKI, RV
HSU, WY
[J]. PHYSICAL REVIEW B, 1987, 36 (13): : 6904 - 6914
[10] STRUCTURES OF SUPERCONDUCTING BA2YCU3O7-D AND SEMICONDUCTING BA2YCU3O6 BETWEEN 25-DEGREES-C AND 750-DEGREES-C
HEWAT, AW
CAPPONI, JJ
CHAILLOUT, C
MAREZIO, M
HEWAT, EA
[J]. SOLID STATE COMMUNICATIONS, 1987, 64 (03) : 301 - 307

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