THE EVOLUTION OF PACKAGES FOR MONOLITHIC MICROWAVE AND MILLIMETER-WAVE CIRCUITS

被引：29

作者：

MIDFORD, TA

WOOLDRIDGE, JJ

STURDIVANT, RL

机构：

[1] GM HUGHES ELECTR, RADAR SYST BUSINESS UNIT, LOS ANGELES, CA 90009 USA

[2] TRW CO INC, REDONDO BEACH, CA 90278 USA

[3] GM HUGHES ELECTRON, DIV MICROWAVE ELECTR, TORRANCE, CA 90509 USA

来源：

IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION | 1995年 / 43卷 / 09期

关键词：

D O I：

10.1109/8.410215

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The maturing of monolithic microwave integrated circuit (MMIC) technology has spawned a variety of new military and commercial applications. As a result, there is an increased emphasis on the packaging of MMIC chips and MMIC-based components. Currently, the industry is applying a number of new assembly and packaging technologies to RF components and subsystems driven by the forces of performance, size and weight, and cost. This paper outlines the current evolution in microwave and millimeter-wave packaging using examples drawn from the area of active array antennas.

引用

页码：983 / 991

页数：9

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