AMORPHOUS METALLIZATIONS FOR HIGH-TEMPERATURE SEMICONDUCTOR-DEVICE APPLICATIONS

被引：46

作者：

WILEY, JD

PEREPEZKO, JH

NORDMAN, JE

GUO, KJ

机构：

[1] UNIV WISCONSIN,DEPT MET & MINERAL ENGN,MADISON,WI 53706

[2] CHINESE ACAD SCI,SHANGHAI INST MET,SHANGHAI,PEOPLES R CHINA

来源：

IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS | 1982年 / 29卷 / 02期

关键词：

D O I：

10.1109/TIE.1982.356654

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

引用

页码：154 / 157

页数：4

共 10 条

[1] STRUCTURE AND PROPERTIES OF METALLIC GLASSES [J].

CHAUDHARI, P ;

TURNBULL, D .

SCIENCE, 1978, 199 (4324) :11-21

[2] PREDICTION OF GLASS-FORMING ABILITY FOR METALLIC SYSTEMS [J].

DONALD, IW ;

DAVIES, HA .

JOURNAL OF NON-CRYSTALLINE SOLIDS, 1978, 30 (01) :77-85

[3]

GUPTA D, 1978, THIN FILMS INTERDIFF, pCH7

[4]

LESELTER MP, 1966, BELL SYST TECH J, V45, P233

[5] DIFFUSION BARRIERS IN THIN-FILMS [J].

NICOLET, MA .

THIN SOLID FILMS, 1978, 52 (03) :415-443

[6]

PECK DS, 1974, P IEEE, V62, P185, DOI 10.1109/PROC.1974.9408

[7]

PEERCY PS, 1981, MAR M AM PHYS SOC PH

[8] PERCOLATION AND CONDUCTIVITY - COMPUTER STUDY .1. [J].

PIKE, GE ;

SEAGER, CH .

PHYSICAL REVIEW B, 1974, 10 (04) :1421-1434

[9]

SPAEPEN F, 1978, METALLIC GLASSES, pCH5

[10]

WILEY JD, SAND807167 SAND LAB

← 1 →