BRAZING OF PRESSURELESS-SINTERED SIC USING AG-CU-TI ALLOY

被引：68

作者：

BOADI, JK

YANO, T

ISEKI, T

机构：

来源：

JOURNAL OF MATERIALS SCIENCE | 1987年 / 22卷 / 07期

关键词：

D O I：

10.1007/BF01082127

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：2431 / 2434

页数：4

共 11 条

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[7] BONDING MECHANISM BETWEEN SILICON-CARBIDE AND THIN FOILS OF REACTIVE METALS [J].

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[8]

Rice R. W., 1976, ADV JOINING TECHNOLO, P69

[9] WETTING AND BONDING OF DIAMONDS BY COPPER-BASE BINARY-ALLOYS [J].

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[10]

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