PROCESSES AT EVAPORATED SILVER FILMS UNDER ANODIC AND CATHODIC LOAD AND DURING AGING - A MORPHOLOGICAL-STUDY

被引：2

作者：

ELWAHED, MGA

WEIL, KG

机构：

来源：

ZEITSCHRIFT FUR PHYSIKALISCHE CHEMIE-WIESBADEN | 1982年 / 129卷 / 01期

关键词：

D O I：

10.1524/zpch.1982.129.1.001

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

引用

页码：1 / 10

页数：10

共 9 条

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[3]

GERISCHER H, 1958, Z ELEKTROCHEM, V62, P256

[4] RELAXATION PROCESSES IN THIN EVAPORATED-FILMS .1. [J].

HENNING, D ;

WEIL, KG .

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[5]

HENNING D, 1980, Z METALLKD, V71, P215

[6] MICROSTRUCTURE CHANGES IN THIN SILVER FILMS [J].

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WEIL, KG .

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[7]

Herring C., 1953, STRUCTURE PROPERTIES, P5

[8] MECHANISM OF ELECTROLYTIC SILVER DEPOSITION AND DISSOLUTION [J].

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BOCKRIS, JOM .

JOURNAL OF CHEMICAL PHYSICS, 1957, 27 (03) :818-819

[9] RECRYSTALLIZATION AND EXCESS FREE-ENERGY IN THIN SILVER FILMS [J].

SCHMIDTIHN, E ;

WEIL, KG ;

WILL, G .

THIN SOLID FILMS, 1972, 12 (02) :273-+

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