IMPROVED ADHESION BETWEEN A SPUTTERED ALUMINA COATING AND A COPPER SUBSTRATE

被引：9

作者：

JARVINEN, R

MANTYLA, T

KETTUNEN, P

机构：

来源：

THIN SOLID FILMS | 1984年 / 114卷 / 03期

关键词：

D O I：

10.1016/0040-6090(84)90128-7

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：311 / 317

页数：7

共 11 条

[1]

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[2]

CAMPBELL DS, 1970, HDB THIN FILM TECHNO, pCH12

[3]

HANSEN M, 1958, CONSTITUTION BINARY, P602

[4] ADHESION OF COPPER-FILMS TO ALUMINUM-OXIDE USING A SPINEL STRUCTURE INTERFACE [J].

KATZ, G .

THIN SOLID FILMS, 1976, 33 (01) :99-105

[5]

KENNEDY TM, 1974, ELECTRON PACK PROD, V14, P136

[6] ATOMIC COMPOSITION OF RF-SPUTTERED ALUMINA COATINGS DETERMINED BY XPS METHOD [J].

MANTYLA, T ;

JARVINEN, R ;

KETTUNEN, P ;

HUTTUNEN, P ;

PESSA, M .

PHYSICA SCRIPTA, 1983, T4 :199-200

[7] ADHESION MEASUREMENT OF THIN-FILMS [J].

MITTAL, KL .

ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1976, 3 (01) :21-42

[8] PROPERTIES OF RF-SPUTTERED AL2O3 FILMS DEPOSITED BY PLANAR MAGNETRON [J].

NOWICKI, RS .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1977, 14 (01) :127-133

[9]

SCHACHNER H, 1975, 5TH P INT C CHEM VAP, P485

[10] HIGH-RATE THICK-FILM GROWTH [J].

THORNTON, JA .

ANNUAL REVIEW OF MATERIALS SCIENCE, 1977, 7 :239-260

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