NI-CU-P AND NI-CO-P AS A DIFFUSION BARRIER BETWEEN AN AL PAD AND A SOLDER BUMP

被引:30
作者
LEE, CY
LIN, KL
机构
[1] Department of Materials Science and Engineering, National Cheng Kung University, Tainan
关键词
D O I
10.1016/0040-6090(94)90113-9
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Investigations have been carried out on the phase transformation and interactions among the multilayers Pb-Sn/Ni-Cu-P/Al and Pb-Sn/Ni-Co-P/Al. Ni3P was formed in both multilayers after thermal treatment at 400 degrees C. Ni3Sn4 was found by means of XRD within the Pb-Sn/Ni-Cu-P/Al multilayer after thermal treatment, whereas the Pb-Sn/Ni-Co-P/Al multilayer formed Ni3Sn4 and CoSn. Interdiffusion, investigated with the aid of S-EM and Auger spectra, between Al and solder was effectively retarded by the Ni-Cu-P layer. Ni-Co-P, was, however, unable to exhibit such barrier behavior.
引用
收藏
页码:93 / 98
页数:6
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