EFFECTS OF OXYGEN ON THE RIE CHARACTERISTICS OF ALUMINUM FILMS

被引:5
作者
ELDRIDGE, JM [1 ]
OLIVE, G [1 ]
LUTHER, BJ [1 ]
MOORE, JO [1 ]
HOLLAND, SP [1 ]
机构
[1] IBM GTD,BURLINGTON,VT 05401
关键词
D O I
10.1149/1.2100560
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
7
引用
收藏
页码:1025 / 1027
页数:3
相关论文
共 7 条
[1]   OXYGEN MONITORS FOR ALUMINUM AND AL-O THIN-FILMS [J].
FAITH, TJ ;
IRVEN, RS ;
ONEILL, JJ ;
TAMS, FJ .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1981, 19 (03) :709-716
[2]  
Maissel L.I., 1970, HDB THIN FILM TECHNO
[4]  
MOVCHAN BA, 1969, PHYS METALS METALLOG, V28, P83
[5]  
RYAN J, COMMUNICATION
[6]   RATE AND PRESSURE-DEPENDENCE OF CONTAMINANTS IN VACUUM-DEPOSITED ALUMINUM FILMS [J].
SPRINGER, RW ;
CATLETT, DS .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1978, 15 (02) :210-214
[7]   INFLUENCE OF SUBSTRATE TEMPERATURE AND DEPOSITION RATE ON STRUCTURE OF THICK SPUTTERED CU COATINGS [J].
THORNTON, JA .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1975, 12 (04) :830-835