POPCORNING - A FAILURE-MECHANISM IN PLASTIC-ENCAPSULATED MICROCIRCUITS

被引：55

作者：

GALLO, AA ^{[1
]}

MUNAMARTY, R ^{[1
]}

机构：

[1] UNIV MARYLAND, CALCE ELECTR PACKAGING RES CTR, COLLEGE PK, MD 20742 USA

来源：

IEEE TRANSACTIONS ON RELIABILITY | 1995年 / 44卷 / 03期

基金：

美国国家科学基金会;

关键词：

FAILURE MECHANISM; POPCORNING; PLASTIC-ENCAPSULATED; MICROCIRCUIT;

D O I：

10.1109/24.406565

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

Conclusions - Popcorning is a failure mechanism in plastic-encapsulated microcircuits. It occurs when the inherently hygroscopic encapsulant is rapidly exposed to high temperatures during reflow solder assembly of the component to a printed circuit card. At these temperatures the moisture absorbed by the molding compound vaporizes and rapidly expands leading to the development of high stresses. When these stresses exceed both the interfacial adhesion strength and the fracture toughness of the molding compound, delamination and cracking result. Cracking is accompanied by a characteristic pop sound (and thus the name popcorning). Popcorning can - lead to a long-term reliability problem, since the cracks can be a path for ionic contaminants, causing corrosion-induced failures. result in sheared or cratered ball bonds, causing electrical failures.

引用

页码：362 / 367

页数：6

共 12 条

[1]

CHIEN IY, 1994, SOLID STATE TECH NOV, P87

[2]

COX NR, 1992, REFLOW TECHNOLOGY HD

[3] MATERIAL FAILURE MECHANISMS AND DAMAGE MODELS [J].

DASGUPTA, A ;

PECHT, M .

IEEE TRANSACTIONS ON RELIABILITY, 1991, 40 (05) :531-536

[4]

ITO S, 1991, 39TH P INT REL PHYS, P190

[5]

Kitano M., 1988, 26th Annual Proceedings. Reliability Physics 1988 (Cat. No.88CH2508-0), P90, DOI 10.1109/RELPHY.1988.23432

[6]

MARKS MR, 1992, INT REL PHY, P190, DOI 10.1109/RELPHY.1992.187645

[7] MOLDING COMPOUND TRENDS IN A DENSER PACKAGING WORLD - QUALIFICATION TESTS AND RELIABILITY CONCERNS [J].

NGUYEN, LT ;

LO, RHY ;

CHEN, AS ;

BELANI, JG .

IEEE TRANSACTIONS ON RELIABILITY, 1993, 42 (04) :518-535

[8]

NGUYEN LT, 1995, ELEC COMP C, P478, DOI 10.1109/ECTC.1995.515324

[9]

PECHT MG, 1995, PLASTIC ENCAPSULATED

[10]

SUZUKI S, 1992, ASME ADV ELECT PACKA, V1, P343

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