PARAMETERS AFFECTING THERMAL FATIGUE BEHAVIOR OF 60SN-40PB SOLDER JOINTS

被引：42

作者：

FREAR, D ^{[1
]}

GRIVAS, D ^{[1
]}

MORRIS, JW ^{[1
]}

机构：

[1] UNIV CALIF BERKELEY LAWRENCE BERKELEY LAB,CTR ADV MAT,BERKELEY,CA 94720

来源：

JOURNAL OF ELECTRONIC MATERIALS | 1989年 / 18卷 / 06期

关键词：

D O I：

10.1007/BF02657518

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：671 / 680

页数：10

共 19 条

[1]

BANG ER, 1975, WELDING RES S, V54, P377

[2] SOLDER FATIGUE PROBLEMS IN POWER PACKAGES [J].

BURGESS, JF ;

CARLSON, RO ;

GLASCOCK, HH ;

NEUGEBAUER, CA ;

WEBSTER, HF .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1984, 7 (04) :405-410

[3]

ELLIS HB, 1987, 11TH P NAV WEAP EL M

[4] A MICROSTRUCTURAL STUDY OF THE THERMAL FATIGUE FAILURES OF 60SN-40PB SOLDER JOINTS [J].

FREAR, D ;

GRIVAS, D ;

MORRIS, JW .

JOURNAL OF ELECTRONIC MATERIALS, 1988, 17 (02) :171-180

[5]

FREAR D, 1987, SPR TMS C DENV, P113

[6]

FREAR D, 1986, MATER RES SOC S P, V72, P181

[7]

FREAR DR, 1987, 3RD P ANN EL PACK CO, V3, P269

[8] THERMAL DEFORMATIONS OBSERVED IN LEADLESS CERAMIC CHIP CARRIERS SURFACE MOUNTED TO PRINTED WIRING BOARDS [J].

HALL, PM ;

DUDDERAR, TD ;

ARGYLE, JF .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1983, 6 (04) :544-552

[9]

KANG SK, 1977, IEEE T PARTS HYB PAC, V13, P318, DOI 10.1109/TPHP.1977.1135203

[10] TEMPERATURE CYCLING OF HIC THIN-FILM SOLDER CONNECTIONS [J].

KELLER, HN .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1981, 4 (01) :132-139

← 1 2 →