MECHANISM OF COPPER NICKEL-ALLOY ELECTRODEPOSITION

被引：67

作者：

CHASSAING, E ^{[1
]}

QUANG, KV ^{[1
]}

WIART, R ^{[1
]}

机构：

[1] UNIV PIERRE & MARIE CURIE,CNRS,PHYS LIQUIDES & ELECTROCHIM LAB 15,F-75252 PARIS 05,FRANCE

来源：

JOURNAL OF APPLIED ELECTROCHEMISTRY | 1987年 / 17卷 / 06期

关键词：

D O I：

10.1007/BF01023611

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

引用

页码：1267 / 1280

页数：14

共 11 条

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[2] KINETICS OF COPPER ELECTRODEPOSITION IN CITRATE ELECTROLYTES [J].

CHASSAING, E ;

QUANG, KV ;

WIART, R .

JOURNAL OF APPLIED ELECTROCHEMISTRY, 1986, 16 (04) :591-604

[3]

COLE KS, 1968, MEMBRANES IONS IMPUL, P183

[4]

ELSAMAHY AA, 1975, J INDIAN CHEM SOC, V52, P752

[5] IMPEDANCE MEASUREMENTS FOR NICKEL DEPOSITION IN SULFATE AND CHLORIDE ELECTROLYTES [J].

EPELBOIN, I ;

JOUSSELLIN, M ;

WIART, R .

JOURNAL OF ELECTROANALYTICAL CHEMISTRY, 1981, 119 (01) :61-71

[6]

GHANDHOUR MFM, 1980, METALLOBERFLACHE, V34, P12

[7] LATERAL EXCHANGE INTERACTIONS IN SUB-MONOLAYER FILMS OF CO-ADSORBED SPECIES [J].

HEPEL, T .

JOURNAL OF ELECTROANALYTICAL CHEMISTRY, 1984, 175 (1-2) :15-31

[8]

Quang K. Vu, 1985, MET FINISH, V10, P25

[9]

QUANG KV, 1986, FEB P INCEF 86 BANG

[10]

Roos J.R., 1984, PROCESS METALLURGY, V3, P177

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