WAVELENGTH-PROPERTY CORRELATION IN ELECTRODEPOSITED ULTRASTRUCTURED CU-NI MULTILAYERS

Multilayered foils with 10% Cu-90% Ni and ultrathin (9–2000Å) layers have been fabricated by electrodeposition. The anodic passivity of Ni and the irreversibility of the Ni/Ni2+ reaction permit alternate deposition of each metal layer from a common electrolyte. SEM, TEM, and x-ray diffraction analysis indicate discrete layer formation and a (100) textured structure. A maximum in the tensile strength and electrical resistivity of these foils was detected at a wavelength of 200Å (20Å Cu + 180Å Ni). The maximum tensile strength obtained (1900 MPa) is over 3 and 4.5 times greater than that for homogeneous Ni and Cu foils and exceeds the maximum value reported for vacuum deposited foils by 70%. © 1990, The Electrochemical Society, Inc. All rights reserved.