MODEL FOR COPPER ELECTROPLATING OF MULTILAYER PRINTED WIRING BOARDS

被引：32

作者：

KESSLER, T

ALKIRE, R

机构：

[1] BELL TEL LABS INC,WHIPPANY,NJ 07981

[2] UNIV ILLINOIS,DEPT CHEM ENGN,URBANA,IL 61801

来源：

关键词：

D O I：

10.1149/1.2133018

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

引用

页码：990 / 999

页数：10

共 24 条

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[4]

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[5]

Gabe D. R., 1971, Transactions of the Institute of Metal Finishing, V49, P17

[6]

Hoar T. P., 1974, PLATING E ORANGE NJ, V61, P35

[7] ROLE OF MASS-TRANSFER IN ELECTROLYSIS OF METALS [J].

IBL, N ;

BRAUN, M .

[8]

IRVINE TH, 1967, MET FINISH, V65, P85

[9]

JAWITZ MW, 1973, MET FINISH, V71, P31

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