PULSE PLATING EFFECTS IN NICKEL ELECTRODEPOSITION

被引：45

作者：

KIM, W

WEIL, R

机构：

来源：

关键词：

D O I：

10.1016/0257-8972(89)90091-1

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

页码：289 / 298

页数：10

共 21 条

[1]

Despic A. R., 1971, Journal of Applied Electrochemistry, V1, P275, DOI 10.1007/BF00688649

[2]

FEIGENBAUM H, 1979, J ELECTROCHEM SOC, V126, P2086

[3]

FUKOMOTO Y, 1981, J MET FINISH SOC JAP, V32, P302

HALL, EO .

PROCEEDINGS OF THE PHYSICAL SOCIETY OF LONDON SECTION B, 1951, 64 (381) :747-753

[5]

HOSOKAWA K, 1980, P INTERFINISH 80, P58

[6] SOME THEORETICAL ASPECTS OF PULSE ELECTROLYSIS [J].

IBL, N .

SURFACE TECHNOLOGY, 1980, 10 (02) :81-104

[7] ELECTROCRYSTALLIZATION IN PULSE ELECTROLYSIS [J].

IBL, N ;

PUIPPE, JC ;

ANGERER, H .

SURFACE TECHNOLOGY, 1978, 6 (04) :287-300

[8]

KIM I, 1987, ASTM STP, V947, P11

[9]

KIM W, 1987, SURF COAT TECH, V31, P109

[10]

KNOEDLER A, 1979, AM ELECTROPLATERS SO