VOID GROWTH BY GRAIN-BOUNDARY DIFFUSION IN FINE-GRAINED MATERIALS

被引:22
作者
COCKS, ACF
SEARLE, AA
机构
[1] Cambridge University Engineering Department, Cambridge, CB2 1PZ, Trumpington Street
关键词
D O I
10.1016/0167-6636(91)90024-T
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Void growth by grain-boundary diffusion in fine grained materials is examined for the situation where the cavity spacing is greater than the grain size, which, in turn, is greater than the void radius. By solving the governing diffusional equations directly it is demonstrated that the volumetric growth rate of a void is much greater than that predicted by a linear viscous analysis, and by a procedure which ignores the full coupling between void growth and deformation.
引用
收藏
页码:279 / 287
页数:9
相关论文
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