NEW DENSIFICATION PROCESS OF THICK-FILMS

Standard inks for the elaboration of low-cost screen-printed components generally contain a glass binder for adherence and filling. However, for applications where the original properties of the active material must not be changed, a glass-free ink is highly desirable. To ensure a good densification of screen-printed films without inorganic binder, we propose that a new step-the application of a mechanical pressure-be added to the standard process. This new process has been applied in the fabrication of low-voltage single-in-line varistors, capacitors, and pyroelectrics components with sandwich electrodes. Such a configuration is difficult to obtain when, as in the standard screen-printing procedure, no pressure is applied to the films. Conductors, resistors, and semiconductor chemical sensors prepared with this technology have also been investigated.