A PHYSICAL MODEL TO PREDICT THE THERMOMECHANICAL BEHAVIOR OF HOT-MELT ADHESIVES

The paper presents a model that allows one to calculate the linear viscoelastic behaviour (complex shear modulus as a function of frequency) and thermomechanical behaviour (complex shear modulus as a function of temperature) of various formulations of hot-melt adhesives containing a polymeric base, a tackifying resin and a crystalline wax. The model takes into account the nature and molecular weight distribution of the polymer, the glass transition temperatures of the polymer and the resin, and the crystallinity of the added wax. A computer program has been derived from the model to simulate the thermomechanical behaviour of the formulations from their composition. It fits, with a reasonable accuracy, the experimental data. The model has been tested for two polymeric bases (EVA and EBA) and two different tackifying resins.