ACCURATE AND EFFICIENT CAD TOOL FOR THE DESIGN OF OPTIMUM PACKAGING FOR (M)MICS

被引：6

作者：

FARAJIDANA, R

CHOW, YL

机构：

来源：

IEE PROCEEDINGS-MICROWAVES ANTENNAS AND PROPAGATION | 1995年 / 142卷 / 02期

关键词：

CAD; MICROWAVE INTEGRATED CIRCUITS; OPTIMUM PACKAGING;

D O I：

10.1049/ip-map:19951655

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A CAD tool is developed for designing optimum packaging of (M)MICs. It is shown that the packaging effects can be isolated in the NPIE Green's function. In this case, the package effects appear as an additive term in the MoM impedance matrix. An optimum packaging design is therefore possible by iteratively computing this additive term for different box sizes.

引用

页码：81 / 88

页数：8

共 12 条

[1]

BURKE JJ, 1990, MAY IEEE MTT S INT M, P255

[2]

CHOW YL, 1991, IEEE T MICROW THEORY, V39, P558

[3] A GENERALIZED-METHOD FOR ANALYZING SHIELDED THIN MICROSTRIP DISCONTINUITIES [J].