MECHANICAL BEHAVIORS OF 60/40 TIN LEAD SOLDER LAP JOINTS

被引:34
作者
ENKE, NF
KILINSKI, TJ
SCHROEDER, SA
LESNIAK, JR
机构
来源
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1989年 / 12卷 / 04期
关键词
D O I
10.1109/33.49002
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页码:459 / 468
页数:10
相关论文
共 22 条
[1]  
BEER FP, 1981, MECH MATER, P72
[2]  
BEVER MB, 1986, ENCY MAT SCI ENG, V7, P5070
[3]  
BLAKE A, 1985, HDB MECHANICS MATERI, P181
[4]  
Clatterbaugh G. V., 1985, 35th Electronic Components Conference (Cat. No. 85CH2184-0), P60
[5]  
ENGELMAIER W, 1984, IEPS OCT, P360
[6]  
GREENFIELD LT, 1947, INT TIN RES I PUBL, V155
[7]  
HALL PM, 1987, 37TH P IEEE EL COMP, P579
[8]  
HARPER CA, 1970, HDB MATERIALS PROCES
[9]  
HIRSCHBERG MH, 1976, NASA TN D8072 TECHN
[10]  
IOSIPESCU N, 1967, J MATER, V2, P537