FINE POWDER FERRITE FOR MULTILAYER CHIP INDUCTORS

Ni-Cu-Zn ferrite co-fired with Ag internal conductor below 900 degrees C is very important for achieving a good quality and cost effective multilayer chip inductor. In this work, optimized processes were obtained to reduce the sintering temperature without deterioration of magnetic properties of ferrite. The main composition we used for low permeability ferrite was Fe2O3(48 similar to 50 mol%), NiO(40 similar to 50 mol%) with the rest of CuO and ZnO. The results manifested that the ferrite powder can be pulverized to fine particle size with 0.2 similar to 0.5 micron. Preliminary compensation of Fe2O3 make the ferrite easier to densify at 900 degrees C, sintered density of 5.15 g/cm(3) can be reached, and has good electromagnetic characteristics and higher Q factor.