SQUEEGEE DEFORMATION STUDY IN THE STENCIL PRINTING OF SOLDER PASTES

被引：30

作者：

MANNAN, SH

EKERE, NN

ISMAIL, I

LO, EK

机构：

[1] Department of Aeronautical and Mechanical Engineering, University of Salford, Salford, M5 4WT, U.K.

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A | 1994年 / 17卷 / 03期

关键词：

SQUEEGEE; STENCIL PRINTING; SURFACE MOUNT TECHNOLOGY; SOLDER PASTE; SCOOPING;

D O I：

10.1109/95.311758

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

We report on the results of an experimental comparison of different types of squeegee blade used in the stencil printing of solder pastes for reflow soldering in SMT, concentrating on paste heights (scooping) and printing defects. We show how our experimental results for squeegee deformation into stencil apertures lead to the construction of a model for squeegee deformation. The model takes into account the force on the squeegee due to solder paste How and some of the non-Newtonian properties of the solder paste. An explanation is proposed for the differences in paste heights between apertures of different orientations.

引用

页码：470 / 476

页数：7

共 8 条

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[8]

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