THERMAL TRANSPORT ACROSS SUPERCONDUCTING SOLDER JOINTS NEAR 0.1 DEGREES K

被引:10
作者
STEYERT, WA
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D O I
10.1063/1.1720936
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
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页码:964 / &
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