PHOTOELASTIC MEASUREMENT OF RESIDUAL THERMOMECHANICAL STRESS IN SIC-REINFORCED GLASS COMPOSITES

被引：2

作者：

KRYNICKI, JW ^{[1
]}

NAGLE, DC ^{[1
]}

GREEN, RE ^{[1
]}

机构：

[1] MARTIN MARIETTA CORP LABS,BALTIMORE,MD 21227

来源：

JOURNAL OF THE AMERICAN CERAMIC SOCIETY | 1992年 / 75卷 / 08期

关键词：

D O I：

10.1111/j.1151-2916.1992.tb04488.x

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Residual thermomechanical stresses in a Nicalon(R) SiC/7740 glass composite system were measured directly. Residual stresses for both single-tow and two-dimensional cloth-reinforced samples were completely described via a digital microphotoelastic technique. Normal stresses approaching 4 MPa were observed in this composite system that had a thermal expansion coefficient mismatch of only 1.8%. The advantages of using this direct, full-field technique over other theoretical and composite model approaches are also discussed.

引用

页码：2225 / 2231

页数：7

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