MCM SUBSTRATE WITH HIGH CAPACITANCE

被引：11

作者：

KAMBE, R

IMAI, R

TAKADA, T

ARAKAWA, M

KURODA, M

机构：

[1] NGK Spark Plug Co., Ltd., Komaki

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 1995年 / 18卷 / 01期

关键词：

THIN FILM CAPACITOR; MCM; SIMULTANEOUS SWITCHING NOISE; DECOUPLING CAPACITOR; CHIP CAPACITOR; COPPER-POLYIMIDE;

D O I：

10.1109/96.365477

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

It is well established that thin film capacitors have good electrical characteristics; for that reason they are often used in high frequency applications. We have investigated planarization of bottom capacitive electrodes which must make direct contact with a co-fired ceramic surface, and adjustment and control of the Thermal Coefficient of Expansion (TCE) difference between high dielectric constant material and the base MCM ceramic substrate. Combining thin film capacitors with MCM substrates can result in high frequency decoupling capacitors (with 100x the capacitance of comparable co-fired thin layer alumina constructions), space savings, and significant improvement in performance over conventional discrete chip capacitors.

引用

页码：23 / 27

页数：5