GAS-ASSISTED EVAPORATIVE COOLING OF HIGH-DENSITY ELECTRONIC MODULES

被引：53

作者：

BARCOHEN, A

SHERWOOD, G

HODES, M

SOLBREKEN, G

机构：

[1] THREE M CO,DIV SPECIALTY CHEM,ST PAUL,MN 55144

[2] MIT,DEPT MECH ENGN,CAMBRIDGE,MA 02139

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A | 1995年 / 18卷 / 03期

关键词：

COOLING; EVAPORATION; IMMERSION; HEAT FLUX; ELECTRONICS;

D O I：

10.1109/95.465144

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Gas-assisted evaporative cooling (GAEC), its advantages in thermal packaging of microelectronics, and its implementation in a prototype high-performance computer module, are described, Attention is then turned to theoretical considerations in the dow of gas-liquid-vapor mixtures in narrow, parallel plate channels, and to the design and operation of an appropriate experimental apparatus. Next, experimental results for the wall temperature, heat-transfer coefficients, and pressure drops are presented and compared to theoretical predictions. It is shown that this novel technique is capable of providing effective thermal management for electronic components, in the presence of both high heat flues (of order 20 W/cm(2)) and high thermal density (of order 50 W/cm(3)).

引用

页码：502 / 509

页数：8