TAB VERSUS WIRE BOND - RELATIVE THERMAL PERFORMANCE

被引：4

作者：

MAHALINGAM, M

ANDREWS, JA

机构：

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1985年 / 8卷 / 04期

关键词：

D O I：

10.1109/TCHMT.1985.1136538

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：490 / 499

页数：10

共 7 条

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ANDREWS, JA ;

MAHALINGAM, LM ;

BERG, HM .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1981, 4 (04) :455-461

[2]

COCHRAN DS, 1983, ICECAP REP, P1

[3]

HEIN VL, 1969, PROC ELECTRON COMPON, P166

[4] HEAT TRANSFER ANALYSIS OF BEAM-LEAD TRANSISTOR CHIP [J].

KAMOSHIDA, M ;

KANI, K ;

SATO, K ;

OKADA, T .

MAHALINGAM, LM ;

ANDREWS, JA ;

DRYE, JE .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1983, 6 (03) :246-256

[6]

MAHALINGAM LM, 1982, IEEE T COMPONENTS HY, V5, P463

[7]

MARSHALL JF, 1984, SOLID STATE TECH AUG, P175