THERMAL COMPONENT MODELS FOR ELECTROTHERMAL NETWORK SIMULATION

被引：71

作者：

HEFNER, AR

BLACKBURN, DL

机构：

[1] Semiconductor Electronics Division, National Institute of Standards and Technology, Gaithersburg

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A | 1994年 / 17卷 / 03期

关键词：

Computer simulation - Computer software - Electric network analysis - Electric network synthesis - Electric network topology - Electronics packaging - Heat sinks - Heat transfer - Semiconductor devices - Temperature distribution - Temperature measurement;

D O I：

10.1109/95.311751

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A procedure is given for developing thermal component models for electrothermal network simulation. In the new electrothermal network simulation methodology, the simulator solves for the temperature distribution within the semiconductor devices, packages, and beat sinks (thermal network) as well as the currents and voltages within the electrical network. The thermal network is represented as an interconnection of compact thermal component models so that the system designer can readily interchange different thermal components and examine different configurations of the thermal network. To facilitate electrothermal network design, the interconnection of the thermal component models is specified by the user in the same way that the interconnection of the electrical network components is specified. The thermal component models are also parameterized in terms of structural and material parameters so that the details of the heat transport physics are transparent to the user. Examples of electrothermal network simulations are given, and the temperature measurement methods used to validate the thermal component models are described.

引用

页码：413 / 424

页数：12

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