GRAIN-STRUCTURE VARIATION WITH TEMPERATURE FOR EVAPORATED METAL-FILMS

被引:77
作者
HENTZELL, HTG [1 ]
GROVENOR, CRM [1 ]
SMITH, DA [1 ]
机构
[1] IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1984年 / 2卷 / 02期
关键词
D O I
10.1116/1.572727
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
引用
收藏
页码:218 / 219
页数:2
相关论文
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[3]  
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[4]  
HENTZELL HTG, UNPUB ACTA METALL
[5]  
HUNDERI O, 1978, 3RD P INT C RAP QUEN, V1, P375
[6]  
Maissel, 1983, HDB THIN FILM TECHNO
[7]  
Martin G., 1980, GRAIN BOUND STRUCT K, P239
[8]  
MOVCHAN BA, 1969, PHYS METALS METALLOG, V28, P83
[9]  
Poate J M, 1978, THIN FILMS INTERDIFF
[10]  
Sanders J.V, 1971, CHEMISORPTION REACTI, P1