THERMAL-CONDUCTIVITY AND SPECIFIC-HEAT OF AN EPOXY-RESIN EPOXY-RESIN COMPOSITE-MATERIAL AT LOW-TEMPERATURES

被引：19

作者：

SCHEIBNER, W

JACKEL, M

机构：

[1] Technischen Univ Dresden, Sektion, Physik, Dresden, East Ger, Technischen Univ Dresden, Sektion Physik, Dresden, East Ger

来源：

PHYSICA STATUS SOLIDI A-APPLIED RESEARCH | 1985年 / 87卷 / 02期

关键词：

COMPOSITE MATERIALS - SPECIFIC HEAT;

D O I：

10.1002/pssa.2210870216

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The thermal conductivity and the specific heat of pure and filled epoxy resins are measured in the temperature range between 2 and 80 K. In order to study the low-temperature thermal conductivity of the filled samples without any acoustic mismatch a filler completely identical with the matrix material is used. The characteristic plateau of the thermal conductivity of amorphous solids between 5 and 15 K is extended to elevated temperatures with growing filler content. A second plateau of the thermal conductivity between 30 and 50 K is observed. It is suggested that the second plateau arises from a mechanism which is due to the anisotropic bonding forces in polymers and related materials.

引用

页码：543 / 547

页数：5

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