ELECTRICAL DESIGN OF A HIGH-SPEED COMPUTER PACKAGING SYSTEM

被引：10

作者：

DAVIDSON, EE

机构：

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1983年 / 6卷 / 03期

关键词：

D O I：

10.1109/TCHMT.1983.1136188

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：272 / 282

页数：11

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