POWER BUS DECOUPLING ON MULTILAYER PRINTED-CIRCUIT BOARDS

被引：126

作者：

HUBING, TH

DREWNIAK, JL

VANDOREN, TP

HOCKANSON, DM

机构：

[1] University of Missouri-Rolla, Rolla

来源：

IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY | 1995年 / 37卷 / 02期

关键词：

D O I：

10.1109/15.385878

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Guidelines for the selection and placement of decoupling capacitors that work well for one-sided or two-sided printed circuit boards are not appropriate for multilayer boards with power and ground planes, Boards without internal planes take advantage of the power bus inductance to help decouple components at the higher frequencies, An effective decoupling strategy for multilayer boards must account for the low inductance and relatively high capacitance of the power bus.

引用

页码：155 / 166

页数：12

共 7 条

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