CHARACTERIZATION OF SILICON OPEN STENCIL MASKS IN AN ION PROJECTION LITHOGRAPHY MACHINE

被引:2
作者
BUCHMANN, LM
MESCHEDER, U
TORKLER, M
机构
关键词
D O I
10.1016/0167-9317(91)90110-Y
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Silicon open stencil masks, realized in a 2-mu-m thick membrane, were investigated with respect to their stress quality, the resistivity against sputter erosion by ion impingement and their response to temperature variations. In a test pattern of an area 20 x 21 mm2 an average distortion of 0.15-mu-m was obtained. The sputter erosion in a nitride top layer under the operating conditions of the projector was found to be 1.5 nm/h.
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页码:353 / 356
页数:4
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共 13 条
  • [1] Seliger, Kubena, Olney, Ward, Wang, J. Vac. Sci. Technol., 16, (1979)
  • [2] Brown, Venkatesan, Wagner, Nucl. Instr. and Methods, 191, (1981)
  • [3] Stengl, Loschner, Hammel, Wolf, Proceed. ESSDERC, (1987)
  • [4] Randall, Flanders, Economou, Donelly, Bromley, J. Vac. Sci. Technol. B, 1, (1983)
  • [5] Behringer, VDI Rept. 584, (1985)
  • [6] Atkinson, Bartelt, Middleton, A minimum step fabrication process for the all-silicon channeling mask, Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 5 B, (1987)
  • [7] Pang, Lyszczarz, Chen, Donelly, Randall, Masked ion beam lithography for submicrometer-gate-length transistors, Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 5, (1987)
  • [8] Stangl, Rudenauer, Maurer, Fallmann, Microcircuit Engineering, 3, (1985)
  • [9] Heuberger, Buchmann, Csepregi, Muller, Ion projection lithography in (in)organic resist layers, Microelectronic Engineering, 5, (1986)
  • [10] Randall, Sivasankar, The thermomechanical stability of ion beam masks, Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 5, (1987)