WAVE MODEL SOLUTION TO THE GROUND POWER PLANE NOISE PROBLEM

被引：121

作者：

LEI, GT

TECHENTIN, RW

HAYES, PR

SCHWAB, DJ

GILBERT, BK

机构：

[1] Department of Physiology and Biophysics, Mayo Medical School, Mayo Foundation, Rochester

来源：

IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT | 1995年 / 44卷 / 02期

关键词：

D O I：

10.1109/19.377836

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, we describe the development of a theoretical field-based or ''wave'' model which we are employing in an attempt to characterize the ground/power plane (e.g., the V-cc plane) structure of a printed wiring board (PWB) or multichip module (MCM). A brief development of the model is presented, followed by simulation results-and insight into the noise phenomena. A test structure and electrical measurements are used to confirm the correctness and applicability of the model.

引用

页码：300 / 303

页数：4

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