ELECTRICAL, STRUCTURAL AND PROCESSING PROPERTIES OF ELECTRICALLY CONDUCTIVE ADHESIVES

被引：55

作者：

LI, L

LIZZUL, C

KIM, H

SACOLICK, I

MORRIS, JE

机构：

[1] Department of Electrical Engineering, Binghamton University, Binghamton

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1993年 / 16卷 / 08期

基金：

美国国家科学基金会;

关键词：

D O I：

10.1109/33.273683

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

There is growing interest in the potential of electrically conductive metal-loaded polymer adhesives for solder replacement in SMT and other microelectronic applications. Eight commercial electrically conductive adhesive pastes were selected for study, including both thermosetting and thermoplastic examples. All were silver based, except for one nickel-polymer composite. The properties on which this work is focused are the microstructure and electrical characteristics, with the specific purpose of determining the conduction mechanisms. The electrical measurements establish that the primary source of electrical resistance is in the silver particles, with negligible contact effects between them. Differential scanning calorimetry results indicate that drifts in the electrical properties are not attributable to incomplete cures. Electrical measurements on simplified structures prepared in the laboratory are also reported.

引用

页码：843 / 851

页数：9

共 21 条

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