SUBSURFACE DAMAGE MECHANISMS AT HIGH-SPEED DUCTILE MACHINING OF OPTICAL-GLASSES

被引：44

作者：

SCHINKER, MG

机构：

[1] Fraunhofer-Institut für Werkstoffmechanik, Freiburg

来源：

PRECISION ENGINEERING-JOURNAL OF THE AMERICAN SOCIETY FOR PRECISION ENGINEERING | 1991年 / 13卷 / 03期

关键词：

DUCTILE MACHINING; OPTICAL GLASSES; SUBSURFACE DAMAGE;

D O I：

10.1016/0141-6359(91)90100-W

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The micromechanisms that occur during the production of new transparent glass surfaces by ductile removal of viscoplastic glass layers have been investigated up to 100 m/s cutting speeds when using monocrystalline diamond cutting tools. It has been found that the factors that limit the surface quality are microshear bands and microripple pattern, subsurface residual stresses, and different types of microcracks, which are influenced by the type of glass, cutting speeds, microgeometry of the cutting edge, depth of the cut, and environmental conditions. At elevated speeds the heat generated in the cutting zone due to adiabatic microshearing gives rise to continuous chip formation, smooth surfaces, and annealing of residual stresses; however, it may also change the glass properties in the processing zone (e.g., glass ceramics). These different surface quality controlling effects involved in the ductile machining of glass and other brittle materials are discussed.

引用

页码：208 / 218

页数：11

共 17 条

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