PROPERTIES AND MICROELECTRONIC APPLICATIONS OF THIN-FILMS OF REFRACTORY-METAL NITRIDES

被引:262
作者
WITTMER, M
机构
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1985年 / 3卷 / 04期
关键词
D O I
10.1116/1.573382
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
引用
收藏
页码:1797 / 1803
页数:7
相关论文
共 43 条
[11]   PREPARATION OF HARD COATINGS [J].
HILL, RJ ;
SCHEUERMANN, G ;
LUCARIELLO, R .
THIN SOLID FILMS, 1977, 40 (JAN) :217-222
[12]   STRUCTURAL STUDIES ON TITANIUM-NITROGEN SYSTEM [J].
HOLMBERG, B .
ACTA CHEMICA SCANDINAVICA, 1962, 16 (05) :1255-&
[13]   STRUCTURE AND ELECTRICAL-PROPERTIES OF TITANIUM NITRIDE FILMS [J].
IGASAKI, Y ;
MITSUHASHI, H ;
AZUMA, K ;
MUTO, T .
JAPANESE JOURNAL OF APPLIED PHYSICS, 1978, 17 (01) :85-96
[14]   MICROSTRUCTURES OF TIN AND TI2N DEPOSITS PREPARED BY ACTIVATED REACTIVE EVAPORATION [J].
JACOBSON, BE ;
NIMMAGADDA, R ;
BUNSHAH, RF .
THIN SOLID FILMS, 1979, 63 (02) :333-339
[15]   OXIDATION-KINETICS OF ZRN THIN-FILMS [J].
KRUSINELBAUM, L ;
WITTMER, M .
THIN SOLID FILMS, 1983, 107 (01) :111-116
[16]  
KRUSINELBAUM L, 1983, THIN SOLID FILMS, V4, P81
[17]  
Kubaschewski O., 1979, METALLURGICAL THERMO
[18]   INFLUENCE OF THE NITROGEN PARTIAL-PRESSURE ON THE PROPERTIES OF DC-SPUTTERED TITANIUM AND TITANIUM NITRIDE FILMS [J].
LEMPERIERE, G ;
POITEVIN, JM .
THIN SOLID FILMS, 1984, 111 (04) :339-349
[19]  
MCCALDIN JO, 1973, APPL PHYS LETT, V22, P64
[20]   REFRACTORY SILICIDES FOR INTEGRATED-CIRCUITS [J].
MURARKA, SP .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1980, 17 (04) :775-792