共 43 条
PROPERTIES AND MICROELECTRONIC APPLICATIONS OF THIN-FILMS OF REFRACTORY-METAL NITRIDES
被引:262
作者:

WITTMER, M
论文数: 0 引用数: 0
h-index: 0
机构:
来源:
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS
|
1985年
/
3卷
/
04期
关键词:
D O I:
10.1116/1.573382
中图分类号:
TB3 [工程材料学];
学科分类号:
0805 ;
080502 ;
摘要:
引用
收藏
页码:1797 / 1803
页数:7
相关论文
共 43 条
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机构: ULVAC CORP,INST SUPER MAT,CHIBA 28912,JAPAN

INAGAWA, K
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机构: ULVAC CORP,INST SUPER MAT,CHIBA 28912,JAPAN

TSURUOKA, K
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机构: ULVAC CORP,INST SUPER MAT,CHIBA 28912,JAPAN

KOMIYA, S
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机构: ULVAC CORP,INST SUPER MAT,CHIBA 28912,JAPAN
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BEISTER, G
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TIN AS A DIFFUSION BARRIER BETWEEN COSI2 OR PTSI AND ALUMINUM
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VERY HIGH-RATE REACTIVE SPUTTERING OF TIN, ZRN AND HFN
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KINETICS OF NITRIDE FORMATION ON TITANIUM TARGETS DURING REACTIVE SPUTTERING
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MECHANISMS OF REACTIVE SPUTTERING OF TITANIUM NITRIDE AND TITANIUM CARBIDE .3. INFLUENCE OF SUBSTRATE BIAS ON COMPOSITION AND STRUCTURE
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MECHANISMS OF REACTIVE SPUTTERING OF TITANIUM NITRIDE AND TITANIUM CARBIDE .1. INFLUENCE OF PROCESS PARAMETERS ON FILM COMPOSITION
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MECHANISMS OF REACTIVE SPUTTERING OF TITANIUM NITRIDE AND TITANIUM CARBIDE .2. MORPHOLOGY AND STRUCTURE
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SIGURD, D
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HO, KT
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NICOLET, MA
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