DESIGN OF MULTICHIP MODULES

被引：14

作者：

SCHAPER, LW ^{[1
]}

机构：

[1] ALCOA ELECTR PACKAGING,DIV THIN FILM,SAN DIEGO,CA 92127

来源：

PROCEEDINGS OF THE IEEE | 1992年 / 80卷 / 12期

关键词：

D O I：

10.1109/5.192075

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The design of multichip modules (MCM's) is a difficult multidisciplinary task involving materials; electrical, thermal, and mechanical performance; system architecture and requirements; and economics. The art of MCM design lies in the global optimization of these often conflicting constraints. This paper discusses the wide range of considerations essential in the design process, and presents several figures of merit to help designers in making the right choices. The paper does not present a detailed formula for designing MCM's, every module design is different and the necessary detail would fill several books. Rather, it presents the process of MCM design and describes the kind of design work which must be done to achieve the proper balance essential for a successful MCM implementation.

引用

页码：1955 / 1964

页数：10